Mastercard Visa Paypal
42nd IASP World Conference on Science Parks and Areas of Innovation
Title:

Platform-based Operation Model of the Innovation Common Technology Service Center Based on Joint Laboratories - A Case Study of IC PARK

Billede:
iasp2025-poster_50x70
Document type:
Conference Paper
BuyOrDownloadButton
2.00 €
  1. Authors
    FullNameWithTitle2:
    Bo Jiang
    FullNameWithTitle2:
    Shiyang Zhang
    FullNameWithTitle2:
    Xin Chu
  2. Publisher
    IASP
  3. Publication date
    September 2025
  4. Place of publication
    Beijing, China
  5. Number of pages
    10
Description:

The integrated circuit design industry is hailed as the crown jewel of the industrial chain, serving as an indispensable core component in various high-tech fields and a key material carrier for cultivating new productive forces. As a hub for China's integrated circuit industry, Beijing is home to nearly a thousand integrated circuit design companies and dozens of universities and research institutes related to integrated circuits. These entities have acquired a large number of inspection and testing equipment, but issues such as idle equipment, low reuse rates, low service efficiency, and high service costs persist. Leveraging the support of its parent company, Zhongguancun Development Group, Zhongguancun Integrated Circuit Design Park Development Co., Ltd. has focused on addressing industry "pain points" by integrating relevant resources to establish a common technology service platform. This platform, centered around joint laboratories and collaborating with leading inspection and testing laboratories, has created a new service model that combines online and offline cooperation with third-party laboratories. This model helps reduce R&D costs and cycles for integrated circuit design companies, enhances the overall quality of industrial development, and fuels the cultivation of new productive forces.  

Keywords: Integrated Circuits, Common Technology Service Platform, Inspection and Testing  

  1. Conference name
    42nd IASP World Conference on Science Parks and Areas of Innovation
  2. Conference theme
    Elevating excellence: Innovation spaces driving high-quality development
  3. Location
    Beijing, China
  4. Start date
    16-09-2025
  5. End date
    19-09-2025